Effect of package materials on warpage of IC package
碩士 === 國立交通大學 === 機械工程系所 === 103 === This research investigated the effects of IC package materials on the package warpage after fabrication using finite element analysis. Two kinds of overmold and four kinds of underfill were taken into account and results indicated that higher coefficient of ther...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/49y5em |