none
碩士 === 國立中央大學 === 工業管理研究所 === 103 === Portable electronic products has strong growth momentum led to huge demand of highly effective miniaturized chips. Wafer level chip scale package (WLCSP) as intermediary, plays an important role, making IC packages tend to be more thin and short in widespread us...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/50247911817789782388 |