The application of tantalum-manganese alloy and copper-germanide on copper interconnect in back-end module of integrated circuit
碩士 === 國立中央大學 === 電機工程學系 === 103 === Abstract According to Moore’s Law, the number of transistors in the integrated circuit has double approximately every twenty-four months. With the scaling of feature size, the performance of chips will be limited not only by the electrical performance of the tra...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/y3qmwq |