An application of LED flip chip by using echelon optics
碩士 === 國立中央大學 === 光電科學與工程學系 === 103 === The study uses the method of printing coating process to produce echeloning first optical reflective surface to replace secondary optical components by coating high reflective resist ink on the surface of circuit board. This new method can improve light effici...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/40808448472212697707 |