Study of the Optimum Parameters of Plasma Treatment in Pre-Wire Bonding for BGA Device
碩士 === 國立彰化師範大學 === 電機工程學系 === 103 === Wire-bonding quality has been a major consideration for BGA packaging, because it mainly affects customer orders. Therefore, in order to meet customer needs, manufactories have been imported new process equipment to improve the quality of Wire-bonding. Before...
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| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/92728754430007851642 |