| Summary: | 碩士 === 國立彰化師範大學 === 電機工程學系 === 103 === Wire-bonding quality has been a major consideration for BGA packaging, because it mainly affects customer orders. Therefore, in order to meet customer needs, manufactories have been imported new process equipment to improve the quality of Wire-bonding. Before Wire-bonding, the plasma cleaning is a important process to improve bonding quality. This study focuses on how to improve reliability of plasma cleaning quality
In this thesis, we discuss how to design the plasma processing parameters and investigate the plasma treatment contact angle drops. The application of response surface methodology. Both will be used to determine the bonding quality by wire-pull testing, ball-shear testing, and IMC (Inter Metal Coverage). Therefore the reliability of plasma treatment will be increased.
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