The Optimization of Package Process of Ball Grid Array in Surface Mount Process
碩士 === 國立高雄第一科技大學 === 機械與自動化工程研究所 === 103 === In recent years, due to the rapid development of the Internet, makes computers, mobile phones and other types of digital related products flourished, including manufacturing and electronic components in high demand, the development of a more subtle of th...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/52557067700016251857 |