Creep Behavior Analysis for the Reliability Assessment on WLCSP
碩士 === 國立清華大學 === 動力機械工程學系 === 103 === Nowadays, electronic packaging has developed to achieve high power, high I/O, good reliability performance and small form factor characteristics. Among the various packages have been adopted by industry, Wafer Level Chip Size Packaging (WLCSP) fulfills above de...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/57015642861079060420 |