Dummy Fill Insertion Considering Density Uniformity Constraint
碩士 === 國立清華大學 === 資訊工程學系 === 103 === As the shrinking of device geometries scale, there is an inevitable need for better planarization of the multilevel interconnect structures. To meet today's advanced lithography methods, we need a planar surface. Or may leads to bad lithography results. CHEM...
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| Format: | Others |
| Language: | en_US |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/50283128130795917427 |