A Scalable Global-Ring Based Architecture Supporting Parametric Fault Testing for Any-Bond TSVs
碩士 === 國立清華大學 === 電機工程學系 === 103 === This thesis presents an any-bond test method for TSV, and any-bond test means that including pre-bond, mid-bond, and post-bond test. We repeatedly use the same set of design-for-testability circuits to achieve our test method. In our test architecture, all the te...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/09899853182525298926 |