A Data-Aware Charge-Sharing Based Low Swing TSV Transmission Scheme for 3D IC with Wide I/O
碩士 === 國立清華大學 === 電機工程學系 === 103 === With the evolution of MOS technology based on Moore’s Law, we have to face the difficulties on designing and the bottleneck on physics and materials including increasing leakage current, RC delays on wire routing and yield issue. 3D integration has the most poten...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/62143062165708208404 |