First-principles Calculations on Fracture Toughness Prediction of Ni-doped Cu6Sn5 Intermetallic Compounds
碩士 === 國立臺灣大學 === 土木工程學研究所 === 103 === Intermetallic compounds (IMC) which appear in the interface of Sn solders and Cu substrate play an important role in quality control in electronic packaging industry. In the system, it has been reported that IMC can be stabilized in eta phase Cu6Sn5 by adding N...
| Main Authors: | , |
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| Format: | Others |
| Language: | en_US |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/99776523326706541052 |