Simulation of Electromagnetic and Semiconductor Characteristics of Microstructures for Three-Dimensional Integrated Circuits and Photovoltaics
博士 === 國立臺灣大學 === 光電工程學研究所 === 103 === Substrate coupling in 3D-ICs using Cu through silicon vias (TSVs) is a predicament widely documented in recent literature. Yet discussions remain limited to the electromagnetic framework, such that a complete understanding of noise propagation and absorption is...
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| Format: | Others |
| Language: | en_US |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/73430496872352292485 |