Feasibility Study on Wet Etching for Wafer Sawing Technology
碩士 === 國立臺灣科技大學 === 化學工程系 === 103 === In this work, the feasibility to combine multi-wire sawing and metal-assisted chemical etching (MaCE) processes for silicon wafer cutting technology is studied. First, layers of Pt metal were deposited on stainless steel substrate via electroless plating method...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/55765310936430933691 |