Thermal Analysis of 3D-IC Packages
碩士 === 國立臺灣科技大學 === 電子工程系 === 103 === This work investigates the thermal performance of modern package types such as 3D-IC and 2.5D-IC with wide I/O bus.The results indicate that in the range of current manufacture art, the size of TSV makes no significant change on the temperatures. Nevertheless, t...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2015
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/01072085394560222017 |