Thermal Analysis of 3D-IC Packages

• Main Authors: Kuo-Ying Tsai, 蔡國英
• Other Authors: Huang-Jen Chiu
• Format: Others
• Language: en_US
• Published: 2015
• Online Access: http://ndltd.ncl.edu.tw/handle/01072085394560222017

碩士 === 國立臺灣科技大學 === 電子工程系 === 103 === This work investigates the thermal performance of modern package types such as 3D-IC and 2.5D-IC with wide I/O bus.The results indicate that in the range of current manufacture art, the size of TSV makes no significant change on the temperatures. Nevertheless, the locations of hot spots are highly associated with the location of TSVs. Also, the package with TSVs location on both sides achieves better thermal performance than the other two TSV strategies.Also the 2.5D-IC is concluded with better thermal performance due to the presence of the silicon interposer. Also it is observed that a lower thermal resistance exists in a certain range of thickness on the glass interposer.