Effect of Electro-Kinetic Force on Cu-Chemical Mechanical Polishing for Planarization Efficiency
碩士 === 國立臺灣科技大學 === 機械工程系 === 103 === Chemical Mechanical Polishing/Planarization (CMP) has been recognized as an irreplaceable technology of approaching the IC fabrication with global planarization, solving the issues of copper metallization and miniaturization of feature size down to 20nm, though...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/96219160966825316930 |