Three-Dimensional Force Analysis on Multi-Wire Diamond Wire Saw Process
碩士 === 國立臺灣科技大學 === 機械工程系 === 103 === Multi-Wire Diamond wire Sawing (MW-DWS) has been the most popular process in wafer slicing process. The reciprocating cutting of MW-DWS is also one of the fixed abrasive machining processes. With high efficiency feature, it is critical in semiconductor wafer i...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/42764107464297574918 |