The Design and Implementation of Molding for Single Unit FCBGA Package
碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩士專班 === 103 === In this thesis statement, we will discuss in single FCBGA with molding whether will prevent Warpage and further cost-down by changing to present assembly of FCBGA which is rearranged by the strip size and then add molding. The FCBGA product is i...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/81724734543677092020 |