The Ball Impact Test Study of Metal-doped Sn-Ag-Cu Solder Joints
碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩士專班 === 103 === This thesis aims to evaluate the reliability performance of solder joint with different metal dopants. The standard lead-free solder which is composed of Sn-Ag-Cu is doped with different metal elements of Ge/Ni/Bi, and experimented by high-speed...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/47359334990227015716 |