The Study of Void Defects in FCBGA Molding Process
碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩士專班 === 103 === Voids are usually occurred in molding process which is a close space of high temperature and pressure condition, and will produce liability issues such as solder extrusion and bridge to short. Usually, void defects is affected by parameters of m...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/54f8s3 |