Study of Epoxy on Molding Wire Sweep in IC Package
碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩士專班 === 103 === Recently the development of IC becomes tremendous and the function becomes diversify. The number of lead frame increases a lot and the wire design becomes complex to meet the function of IC. The molding control becomes an issue in the IC package...
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/24322290687352628399 |