Study of Wafer Backside Grinding for WLCSP Product
碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩士專班 === 103 === This thesis is mainly aimed to study grinding wheel rotation, rough grinding steps and feeding speed, fine grinding revolution speed, and fine grinding thickness of backside grinding parameters for wafer level chip scale package (WLCSP) 12 inch...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/43109742625506680444 |