Study of Wire Bonding Process for LED
碩士 === 國立虎尾科技大學 === 光電與材料科技研究所 === 103 === In this study, we optimize the wire bonding process for 460 nm blue light emitting diodes (LEDs) chip. The LEDs can operate and enhance the reliability when the environment temperature changes by optimizing the wire diameter and wire camber. In addition, we...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/8472gz |