Pressure sensor with flip-chip packaging process
碩士 === 國立臺北科技大學 === 機電整合研究所 === 103 === This thesis presents the design of a Pressure Sensor by a 0.18μm CMOS-MEMS process .The pressure sensor parts take the post- fabrication process to make differential capacitive pressure sensor, which is generated by the operation principle of differential capa...
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| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/exvvkq |