Pressure sensor with flip-chip packaging process
碩士 === 國立臺北科技大學 === 機電整合研究所 === 103 === This thesis presents the design of a Pressure Sensor by a 0.18μm CMOS-MEMS process .The pressure sensor parts take the post- fabrication process to make differential capacitive pressure sensor, which is generated by the operation principle of differential capa...
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| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/exvvkq |
| Summary: | 碩士 === 國立臺北科技大學 === 機電整合研究所 === 103 === This thesis presents the design of a Pressure Sensor by a 0.18μm CMOS-MEMS process .The pressure sensor parts take the post- fabrication process to make differential capacitive pressure sensor, which is generated by the operation principle of differential capacitance by three electrode plates.When the pressure changes, the middle of the suspension layer will displace resulting in the change of differential capacitance signals. And then we use the amplifier to read the signal of differential capacitance. The circuit effectively suppresses common mode noise. This paper presents a concept which is a design of package ring on the chip.Using the flip-chip packaging process to form a protection cavity and allow the MEMS structure measurement in which to sense.
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