Obstacle-Avoiding Routing Algorithm for Redistribution Layer
碩士 === 淡江大學 === 電機工程學系碩士班 === 103 === RDL, redistribution layer, mostly applies on Flip-Chip technology in recent years. Here is the mention of Flip-Chip technology, which connecting both integrated circuit and the substate together, based on small-size chip and high-IO-density packaging. In the pac...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/21184035946052666070 |