Implement Six Sigma DMAIC Model to Improve Wafer Quality
碩士 === 國立雲林科技大學 === 工業工程與管理系 === 103 === With the developing trend of miniaturization on integrated circuits, microparticles on silicon wafer surface show the distinctive effectiveness on the further BEOL. Soft lithography of BEOL demonstrates like photography modified through exposure and developin...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/05065771539143443474 |