The Application of Light-Sensitive Ink in Metalization on a Flexible Substrate
碩士 === 國防大學理工學院 === 化學工程碩士班 === 104 === In this study, a photoreactive and metal-platable polymer ink is developed and used for electroless copper plating. The substrate is first immersed in a mixture consisting of phenyl bis(2,4,6-trimethylbenzoyl) phosphine oxide (Irgacure 819) as photoinitiator,...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/68674842939417693086 |