Study Taguchi experimental method used in Thinning Wafer Cutting Process Quality
碩士 === 逢甲大學 === 工業工程與系統管理學系 === 104 === In this paper, IC semiconductor packaging industry for the study, along with the advancement of technology, integrated circuit （Integrated Circuit, IC） towards the fast, multi-performance, high reliability and overall slim and light direction, the wafer thinni...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/75suus |