The Research of Slicing Parameters by Using Multi-wire Sawing Diamond Wire to Slice Sapphire Ingot
碩士 === 遠東科技大學 === 機械工程研究所在職專班 === 104 === With the great progress in material technology, brittle materials have been developed and applied to many practical fields. In recent decades industries of smiconductor, solar energy, light-emitting diode(LED ), etc. Have used several brittle materials,...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/73488163450562243720 |