The study of micro-scale Cu Metallization on flexible interposer
碩士 === 義守大學 === 電子工程學系 === 104 === The ever-increasing market for portable electronic devices has resulted in an equally heavy demand for flexible substrate, flexible copper clad laminate (FCCL) being among the most popular. A typical FCCL construction includes a polyimide (PI) substrate, a thin met...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/kwt332 |