Optimum Condition Improvement For IC Under-fill of Flexible Printed Circuit Board
碩士 === 崑山科技大學 === 電機工程研究所 === 105 === The main study of this document is on under-fill dispensing techniques for IC after SMT process of flexible printed circuit (FPC) with high sensitive finger print sensor module. With various researches on gluing parameters, gluing routes and baking condition, th...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/23836037234831084047 |