Study of Automatic Machine Vision for Exterior Defection and Rapid Inspection of BGA/QFN Packages
碩士 === 國立高雄應用科技大學 === 電子工程系碩士班 === 104 === With the speedy development of science and technology，semiconductor manufacturing technology is keeping improvement, also the package technology of semiconductors is developed toward an era of smaller, more sophisticated generation as well. In addition th...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/vp9md9 |