A Study of Alloying Elements Addition and Aging Treatment on the Microstructures and Mechanical Properties of Sn-Zn-Based Lead-Free Solder and Solder Paste.
碩士 === 國立高雄應用科技大學 === 模具工程系 === 104 === This paper investigates the changes in mechanical properties and IMC layer of Sn-Zn-based lead-free solders after the aging treatment. In the experiments, the Sn-xZn(x=4, 7)wt.% is used as solder base; Cu(2.5wt.%) and Ag (2.5wt.%) are added to Sn-4Zn lead-free...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/sn2n24 |