Gradient Fishbone Design For IC Mold Flow Analysis
碩士 === 高苑科技大學 === 機械與自動化工程研究所 === 104 === In the semiconductor manufacture, the purpose of IC packaging, one of the back end processes, is to build the complete frameworks of IC chips while to protect the chips from physical damage and chemical change caused by the surroundings which will affect IC’...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/51440047658937623748 |