Using Copolymers as Suppressors in a Copper Plating Bath for Through-Hole Filling
碩士 === 國立中興大學 === 化學工程學系所 === 104 === About the through-hole (TH) metallization, to meet the recent requirement of a dense circuit design, the traditional plated through-hole (PTH) is replaced by TH filling plating with copper, which improve the reliability issue caused by resin plug process. Howeve...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/87955085711212260561 |