Influence of Current density on the growth of intermetallic compounds between Sn and Cu films
碩士 === 國立中興大學 === 精密工程學系所 === 104 === In this study, the investigation of electromigration defects due to currents stress effects between solder and copper substrate were performed. Experiments were tested during heating; Heating and applied current; Heating. We observed microstructural changes, mea...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/56473479322006103480 |