| Summary: | 碩士 === 國立中興大學 === 精密工程學系所 === 104 === In this study, the investigation of electromigration defects due to currents stress effects between solder and copper substrate were performed. Experiments were tested during heating; Heating and applied current; Heating. We observed microstructural changes, measured resistivity changes were provided by using four point probe measurements. The result show that intermetallic compound thickness increases with increasing heating time both 100℃ and 200℃. For heattreated only samples, the intermetallic compound growth mechanism controlled by grain boundary diffusion. For applied current and heating samples, the intermetallic compound growth mechanism was dominated by volume diffusion and interface reaction. The percentage increase in the resistivity changes linearly, as the temperature increases the slope increases, resistivity change with the film microstructural changes are closely related.
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