The interfacial reaction of Ag-xPd wire bonding on Al pad under various testing conditions
碩士 === 國立成功大學 === 材料科學及工程學系 === 104 === The industry is trying to replace part of gold and copper wire bond with silver wires. Ag-Pd alloy wire was reported as a potential candidate because of its high reliability. This study investigated the interfacial reaction of Ag-xPd wire bonding on Al pad und...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/10491905604810275587 |