The interfacial reaction of Ag-xPd wire bonding on Al pad under various testing conditions
碩士 === 國立成功大學 === 材料科學及工程學系 === 104 === The industry is trying to replace part of gold and copper wire bond with silver wires. Ag-Pd alloy wire was reported as a potential candidate because of its high reliability. This study investigated the interfacial reaction of Ag-xPd wire bonding on Al pad und...
Main Authors: | Wei-HsiangHuang, 黃蔚翔 |
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Other Authors: | kwang-Lung Lin |
Format: | Others |
Language: | zh-TW |
Published: |
2016
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Online Access: | http://ndltd.ncl.edu.tw/handle/10491905604810275587 |
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