3D-IC Built-In Diagnosis Architecture for TSVs with Different Placement and Impact Ranges of Crosstalk Faults
碩士 === 國立成功大學 === 電機工程學系 === 104 === Through Silicon Vias (TSVs) play an important role in 3D chip integration. By providing vertical interconnection, routing area can be decreased and bandwidth can be increased. Effective and efficient testing for correct operation of TSVs is essential for 3D IC de...
| Main Authors: | , |
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| Format: | Others |
| Language: | en_US |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/29044172126365161562 |