Reliability Analysis of FC-PBGA Lead Free Solder Ball
碩士 === 國立成功大學 === 機械工程學系 === 104 === This master's thesis uses finite element software ANSYS15.0 to analyze the Filp-Chip Plastic Ball Grid Array packaging (FC-PBGA) which minify substrate and solder ball under accelerated thermal cycling loading. We will observe the thermal mechanical behavior...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/62857488848907305352 |