Warpage Simulation for Reconfigured Wafer
碩士 === 國立成功大學 === 機械工程學系 === 104 === The warpage of a reconfigured wafer that consists of singulated silicon dies embedded in epoxy molding compound (EMC) under process thermal history is considered. Warpage of reconfigured wafer has a strong implication on the fan-out packaging technology because i...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/16558048666134915353 |