Flip-Chip-On-Board Packaging of GaAs Device on Low-Cost Liquid Crystalline Polymer Substrate for RF Applications
碩士 === 國立交通大學 === 光電系統研究所 === 104 === This study focuses on low-cost liquid crystalline polymer (LCP) substrate for high frequency flip-chip packaging applications. LCP substrate has low dielectric constant and low loss tangent, exhibiting a potential candidate for high frequency packaged. A coplana...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/01977746350643523030 |