Study of Metallurgical Reactions and Electromigration of 30μm Cu/SnAg/Ni and Cu/SnAg/Cu Microbumps
碩士 === 國立交通大學 === 工學院加速器光源科技與應用碩士學位學程 === 104 === With intent to satisfy the demand of smaller electric component, the volume of solder continue shrinking. In three-dimensional integrated circuit, the microbump has been adopted to be interconnections between chips. The bump height decrease to 20μm o...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/3yjhkv |