Etch Study of Titanium Oxide Film by Fluorine-based Chemistries
碩士 === 國立交通大學 === 材料科學與工程學系所 === 104 === Titanium nitride (TiN) has been adopted as a metal hardmask in the dual-hardmask dual damascene patterning of dielectrics during the fabrication of copper interconnects. This minimizes plasma damage on the low-k interlayer dielectric, which is not exposed to...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/99161681243614014264 |