Effects of Metallization Materials and Solder Height on Electromigration Failure Mechanism of Microbumps
碩士 === 國立交通大學 === 材料科學與工程學系所 === 104 === As electronic devices become more functional and miniature, two dimensional packaging becomes insufficient. Three dimensional packaging is gradually replacing two dimensional packaging, because of its high-density input/output (I/O) interconnects. Electromigr...
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| Format: | Others |
| Language: | zh-TW |
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2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/8k372f |