Electromigration Study in Flip-chip with 15μm Thick Sn2.3Ag Solder Joints at High Temperatures
碩士 === 國立交通大學 === 工學院半導體材料與製程設備學程 === 104 === Because the miniaturization of integrated circuits (ICs), flip-chip become main packaging technology for wafer-end jointing. In recent years, the miniaturization trend still continues for portable and functional product. Traditional flip-chip packag...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/mgqc9r |