Synchrotron Radiation X-Ray Measurement of Residual Stress in Sn Films and the Effect on Kinetic Analysis of Sn Whisker Growth

博士 === 國立中央大學 === 化學工程與材料工程學系 === 104 === Spontaneous Sn whisker growth is one of the most serious reliability problems for electronic devices. Sn and Cu are commonly used in electronic packaging, and they easily form intermetallic compounds (Cu6Sn5) at room temperature, inducing compressive stress,...

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Bibliographic Details
Main Authors: Hao Chen, 陳灝
Other Authors: 吳子嘉
Format: Others
Language:en_US
Published: 2016
Online Access:http://ndltd.ncl.edu.tw/handle/svpq59